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Summary of Benefits

ADVANTAGES VALUE IN USE

Density and weight reduction

Volume displacement by low density functional filling material

Increased stiffness

Due to high compressive strength and optimum filling of interspacial voids

Improved impact resistance

Owing to its capacity to absorb and disperse energy within the binder matrix

Resin extension

Less resin or binder needed due to low surface area and spherical geometry of particles

Reduced shrinkage

Resulting from resin (binder) extension and particle size distribution

Reduced warpage (dimensional error)

Due to improved dimensional stability, reduced binder and less shrinkage

Improved thermal insulation

Ceramic composition and hollow structure enhances low thermal conductivity

High temperature resistance

High melting point, non-combustible nature and stability at high temperatures

Optimised pigmentation

Reduces white pigments costs and also formulation weight

Friendly water based formulas

Neutral pH, resulting in less or no need for coated pigments and neutralisers

Improved durability

Enhanced corrosion resistance and UV stability

Environmentally friendly

Eco-friendly alternative to polymer based spheres / beads

Easy formulation

Simple dispersion and incorporation into existing or new formulas

Adding value throughout the life cycle of end products

Lower formulation costs

Through resin extension and lower weight products

Transport and packaging costs

Lighter final product weight & less expensive packaging materials needed

Lower labour and installation costs

Easier handling of materials during production and faster and lighter to install components

Key Properties

FUNCTIONAL LOW DENSITY

  • Physical form of a free flowing powder
  • Low bulk density of 0.40 g/cc
  • Hollow structure
  • With a partial vacuum inside
  • Relative Density 0.8 g/cc
  • Particle size 20 – 500 microns (different grades available)
  • Over 94% floaters by volume

HIGH COMPRESSIVE STRENGTH

  • Isostatic pressure tests show over 70% rate of particle survival at 4,800 psi (33 MPa)
  • This is typically over 30% greater than other microspheres of similar density
  • And 20 times higher than expanded glass fillers

THERMAL RESISTANCE

  • Industry leading melting point at over 1700⁰C
  • Higher alumina content
  • Lower iron oxide content
  • Very low rate of thermal expansion (d) 8 x 10-6
  • Super low conductivity of 0.1 W/m / ⁰C
  • Thermal insulation due to the thin wall section encapsulating a hollow (near vacuum) core

CHEMICALLY INERT

  • Due to its ceramic nature, E-SPHERES® are an extremely unreactive substance
  • Resistant to most known chemicals such as solvents, organic chemicals, water, acid or alkalis
  • Compatible with both waterborne and solvent based resin systems
  • Neutral pH makes it cost effective and easy to use to formulate coatings and plasters

NON DANGEROUS GOODS

E-SPHERES® have undetectable levels of crystalline silica/quartz (at the present detection limits for bulk silica of 1%) & are classified as a non-hazardous substance.

They are also:

  • Non combustible
  • Non toxic
  • Non flammable
  • Non reactive
  • Non corrosive

GEOMETRY & LOW ABSORPTION

  • Spherical shape maximises filling properties (volume) and minimised area of contact
  • For example: less resin to wet the surface
  • This is an advantage against most ground fillers or foam type glass spheres
  • Very low absorption optimises its resin extension qualities
E-SPHERES® SL Series: Non absorbent and optimal geometry.
Expanded glass: random shape and porous structure, diminishing its filling properties.

COLOUR

  • E-SPHERES® SL Series are whiter than any other HCM in the market thanks to their unique chemical properties
  • Also whiter than most lightweight fillers
  • Potential reduction of cost & weight due to less white pigments needed in formulations
  • Less TiO2 required

A world of possibilities

E-SPHERES® are an incredibly versatile additive, which also add value and improve performance of engineered materials and products.

Contact us for more information about how E-SPHERES® could enhance your technologies.