ADVANTAGES | VALUE IN USE |
Density and weight reduction |
Volume displacement by low density functional filling material |
Increased stiffness |
Due to high compressive strength and optimum filling of interspacial voids |
Improved impact resistance |
Owing to its capacity to absorb and disperse energy within the binder matrix |
Resin extension |
Less resin or binder needed due to low surface area and spherical geometry of particles |
Reduced shrinkage |
Resulting from resin (binder) extension and particle size distribution |
Reduced warpage (dimensional error) |
Due to improved dimensional stability, reduced binder and less shrinkage |
Improved thermal insulation |
Ceramic composition and hollow structure enhances low thermal conductivity |
High temperature resistance |
High melting point, non-combustible nature and stability at high temperatures |
Optimised pigmentation |
Reduces white pigments costs and also formulation weight |
Friendly water based formulas |
Neutral pH, resulting in less or no need for coated pigments and neutralisers |
Improved durability |
Enhanced corrosion resistance and UV stability |
Environmentally friendly |
Eco-friendly alternative to polymer based spheres / beads |
Easy formulation |
Simple dispersion and incorporation into existing or new formulas |
Summary of Benefits
Adding value throughout the life cycle of end products
Lower formulation costs |
Through resin extension and lower weight products |
Transport and packaging costs |
Lighter final product weight & less expensive packaging materials needed |
Lower labour and installation costs |
Easier handling of materials during production and faster and lighter to install components |
Key Properties
FUNCTIONAL LOW DENSITY
- Physical form of a free flowing powder
- Low bulk density of 0.40 g/cc
- Hollow structure
- With a partial vacuum inside
- Relative Density 0.8 g/cc
- Particle size 20 – 500 microns (different grades available)
- Over 94% floaters by volume
HIGH COMPRESSIVE STRENGTH
- Isostatic pressure tests show over 70% rate of particle survival at 4,800 psi (33 MPa)
- This is typically over 30% greater than other microspheres of similar density
- And 20 times higher than expanded glass fillers
THERMAL RESISTANCE
- Industry leading melting point at over 1700⁰C
- Higher alumina content
- Lower iron oxide content
- Very low rate of thermal expansion (d) 8 x 10-6
- Super low conductivity of 0.1 W/m / ⁰C
- Thermal insulation due to the thin wall section encapsulating a hollow (near vacuum) core
CHEMICALLY INERT
- Due to its ceramic nature, E-SPHERES® are an extremely unreactive substance
- Resistant to most known chemicals such as solvents, organic chemicals, water, acid or alkalis
- Compatible with both waterborne and solvent based resin systems
- Neutral pH makes it cost effective and easy to use to formulate coatings and plasters
NON DANGEROUS GOODS
E-SPHERES® have undetectable levels of crystalline silica/quartz (at the present detection limits for bulk silica of 1%) & are classified as a non-hazardous substance.
They are also:
- Non combustible
- Non toxic
- Non flammable
- Non reactive
- Non corrosive
GEOMETRY & LOW ABSORPTION
- Spherical shape maximises filling properties (volume) and minimised area of contact
- For example: less resin to wet the surface
- This is an advantage against most ground fillers or foam type glass spheres
- Very low absorption optimises its resin extension qualities
E-SPHERES® SL Series: Non absorbent and optimal geometry.
Expanded glass: random shape and porous structure, diminishing its filling properties.
COLOUR
- E-SPHERES® SL Series are whiter than any other HCM in the market thanks to their unique chemical properties
- Also whiter than most lightweight fillers
- Potential reduction of cost & weight due to less white pigments needed in formulations
- Less TiO2 required
A world of possibilities
E-SPHERES® are an incredibly versatile additive, which also add value and improve performance of engineered materials and products.
Contact us for more information about how E-SPHERES® could enhance your technologies.